After continuous development since its establishment in 2010, NvisANA has been the first in the world to develop and supply ‘M-SPEC_MW300 Series’, a device that automatically analyzes NVD during the semiconductor production process.

In the semiconductor industry, as the process becomes smaller, power efficiency, performance, and productivity per unit increase. Accordingly, semiconductor manufacturers are engaged in fierce competition to develop ultra-fine processes up to 5 nm and 3 nm following the recent mass production of 7 nm.
As this process miniaturization increases the possibility of causing semiconductor defects, the demand for technology for detecting contamination during the manufacturing process has increased.

In 2015, after continuous R&D, NvisANA succeeded in developing the world's first equipment to fully automatically analyze the metallic contamination of wafers in the process of manufacturing within the semiconductor line. NvisANA repeatedly upgraded the performance of its main product ‘M-SPEC_MW300 Series’ and supplied about 60 equipment to domestic and overseas semiconductor production lines and silicon wafer production lines.

After that, NvisANA, which expanded its metallic contamination monitoring technology, developed and sold the 'M-SPEC_MG3000/IG3000 Series', which fully automatically analyzes metallic and ionic contamination in the process gas for semiconductors, and sold it to overseas companies. Developed the 'M-SPEC_MC3000 series', which automatically analyzes metallic contamination, and supplied it to domestic companies.

After continuous development since its establishment in 2010, NvisANA has been the first in the world to develop and supply ‘M-SPEC_MW300 Series’, a device that automatically analyzes NVD during the semiconductor production process.

In the semiconductor industry, as the process becomes smaller, power efficiency, performance, and productivity per unit increase. Accordingly, semiconductor manufacturers are engaged in fierce competition to develop ultra-fine processes up to 5 nm and 3 nm following the recent mass production of 7 nm.
As this process miniaturization increases the possibility of causing semiconductor defects, the demand for technology for detecting contamination during the manufacturing process has increased.

In 2015, after continuous R&D, NvisANA succeeded in developing the world's first equipment to fully automatically analyze the metallic contamination of wafers in the process of manufacturing within the semiconductor line. NvisANA repeatedly upgraded the performance of its main product ‘M-SPEC_MW300 Series’ and supplied about 60 equipment to domestic and overseas semiconductor production lines and silicon wafer production lines.

After that, NvisANA, which expanded its metallic contamination monitoring technology, developed and sold the 'M-SPEC_MG3000/IG3000 Series', which fully automatically analyzes metallic and ionic contamination in the process gas for semiconductors, and sold it to overseas companies. Developed the 'M-SPEC_MC3000 series', which automatically analyzes metallic contamination, and supplied it to domestic companies.